Hawk USA LLC
temp
  Lapping Abrasive Powder

HFO

   ∙ An alumina type precision lapping powder
   ∙ Suited for lapping silicon wafer, GaAs,  GaP, 
      optical lenses, crystal, and hardened glass 
   ∙ Providing constant and stable lapping capability
      with no scratch on the surface of the object being lapped

      

 ◈HWA
    ∙ A fused white alumina abrasive powder
    ∙ For use as a material in super finishing precision 
       grindstones, lapping cloth or paper, metals, quartz 
       crystal and semiconductor
    ∙ Being chemically inert and able to bear high temperatures     
    ∙ Consistent reaction with organic matter

 ◈HGC
     A green silicon carbide lapping agents with
       high purity SiC      
   ∙ For use in super finishing precision
       grindstones, crystal, ferrite, and processing
       various resins
    ∙ Superior lapping and polishing capabilities 
    ∙ Having the ability to withstand high temperatures
       


 HGC
   A green silicon carbide lapping agents with high 
     purity SiC 

   For use in super finishing precision grindstones, 
     crystal, ferrite, and processing various resins
  
 Superior lapping and polishing capabilities 
  
 Having the ability to withstand high temperatures 
 HGC
   A green silicon carbide lapping agents with high 
     purity SiC 

   For use in super finishing precision grindstones, 
     crystal, ferrite, and processing various resins
  
 Superior lapping and polishing capabilities 
  
 Having the ability to withstand high temperatures 
 HGC
   A green silicon carbide lapping agents with high 
     purity SiC 

   For use in super finishing precision grindstones, 
     crystal, ferrite, and processing various resins
  
 Superior lapping and polishing capabilities 
  
 Having the ability to withstand high temperatures 
 ◈HC 
    ∙ A black silicon carbide lapping agent 
    ∙ For use in precision lapping, polishing cloth and 
       paper, lapping of stones, cast iron, brass, glass, 
       and semiconductor crystals 
    ∙ Stable cutting edges and ideal particle size 
       distribution with use of abrasive machining


 HC 
   A black silicon carbide lapping agent 
   For use in precision lapping, polishing cloth and 
      paper, lapping of stones, cast iron, brass, glass, and 
      semiconductor crystals
 
   Stable cutting edges and ideal particle size 
      distribution with use of abrasive machining
  Polishing Pads
       HHPC 
          ∙ A White Urethane Impregnated Fiber Based Pad 
          ∙ For Final Polish and Lapping crystal, glass and 
             polycarbonates 
          ∙ Especially applied in sapphire and Fused silica 
          ∙ Embossed pads having a C scale harness of 60 
             on the pillows 
          ∙ A channel depth of ~ 50% is on the .050" thick material
          ∙ The max. sizes of the embossed pads are 900mm 
          ∙ Can replace  Suba X and softer blown urethane pads




    ◈HPBN 
       ∙ A Poretex Black Polishing Pad 
       ∙ Well suited For final polishing of silicon, oxide, glass
          or metal precision applications 
      ∙ Reducing pad loading 
       ∙ Increasing pad life 
      ∙ up to 53" of diameter 
       ∙ 0.050" of thickness 
       ∙ Can replace Polytex supreme


 ◈HPPP 
    ∙ A Napless Chemotextile Polishing Pad 
    ∙ Oil, water, and alcohol resistant with a Pressure 
       Sensitive Adhesive (PSA) backing 
    ∙ For final polishing of ferrous and nonferrous metals,
       composites, polymers, cast irons, ceramics, carbides, 
       thermal spray coatings, electronics, pcb's, minerals,
       and glass 
    ∙ Available size from 2" to 16" diameter


       Soudafoam 2K 
          ∙ SoudaFoam 2K is a two-component, selfexpanding, 
             ready-to-use polyurethane foam. It is typically foam 
             for mounting. 
          ∙ Excellent fixing capacities 
          ∙ Can be trimmed after 30 minutes (20C degrees) 
          ∙ Filling of cavities 
          ∙ Application of a soundproofing layer on motors 
          ∙ Improving insulation in cooling systems  
          ∙ Packaging: aerosol can 400ml
 ◈ Colloidal Slurry
HCS80 
   ∙ For polishing electronic substrates made of silicon, 
      GGG, LiTaO³, LiNbO³, Sapphire, or other materials 
    Able to provide a damage-free polished surface  
      with a high degree of efficiency





 ◈HCS3700
    ∙ For polishing the surface of silicon at the final
       polishing stage
     Comprised of high quality super fine powder
       dispersed in a liquid composed of special 
       ingredients


  ◈HCS7520
      ∙ For polishing GaAs wafer
      ∙ Minimized scratch and particle defects while
         maximizing planarity across the wafer surface





HINSEC 
   ∙ For polishing GaAs wafer, GaP wafer, and 
      LED-related GaAs or GaP products 
    It is more effective with using our lapping 
      abrasive of HFO2000, HFO3000, and 
      HWA3000






◈ Diamond Slurry
 ◈HMDP 
     ∙ Monocrystalline Structure Synthetic Diamond 
        Powders 
     ∙ Has a slightly irregular shape with multiple cutting 
        edges 
     ∙ Oil, glycol and water based vehicles 
     ∙ Are used in resin bond wheels for lapping and 
        polishing of various materials such as ceramics, 
        carbides, & sapphires 
     ∙ Are used in metal bond wheels for grinding of 
        Quartz, Ceramics, Sapphires and other hard 
        materials 
     ∙ For general applications where polycrystalline's 
        features are not required



  ◈HPDP
     ∙ Polycrystalline Structure Diamond Powders 
     ∙ Has no cleavage planes 
     ∙ The highest material removal rates 
     ∙ Allowing for finer finishes in less time 
     ∙ Causing less sub-deformation 
     ∙ For lapping and polishing of the ferrites and 
        silicon, memory disc surface texturing, 
        ceramics, sapphires, and etc 



              HPEG200 
                 ∙ A polyethylene glycol with an average 
                    molecular weight of 200, a clear, viscous 
                    liquid at room temperature 
                 ∙ For electro-polishing and electroplating 
                    processes and in drawing and extrusion 
                    compounds 
                 ∙ Water Solubility 
                 ∙ 4.5 - 7.0 (pH, 5% aqueous solution) 



          ◈HPEG300 
             ∙ A polyethylene glycol with an average 
                molecular weight of 300, a clear, viscous 
                liquid at room temperature 
             ∙ For electro-polishing and electroplating 
                processes and in drawing and extrusion 
                compounds 
             ∙ Water Solubility 
             ∙ 4.5 - 7.5 (pH, 5% aqueous solution)